The small and powerful STPA1603C turbo-molecular pump has been designed using advanced rotor technology. This provides high throughput, maximum reliability and class leading performance which is demanded by the latest generation of semiconductor processes.

Features and Benefits

  • Advanced rotor design  
    • Increased performance
    • Higher gas throughput
    • High reliability
    • Maintenance free
    • Harsh process compatible
  • 5 Axis Magnetic Suspension System  
    • Zero contamination
    • Low vibration
  • Corrosion Resistant  
    • Harsh process compatible
    • Increased life
  • Compact design  
    • Small footprint
    • Half rack controller
  • Advanced controller design 
    • Auto tuning
    • Self diagnostic functions
    • d.c. motor drive
    • Battery-free operation


  • Plasma etch (chlorine, fluorine and bromine chemistries) for metal (aluminum), tungsten and dielectric (oxide) and polysilicon
  • Electron cyclotron resonance (ECR) etch
  • Film deposition CVD, PECVD, ECRCVD, MOCVD
  • Sputtering
  • Ion implantation source, beam line pumping end station
  • MBE
  • Diffusion
  • Photo resist stripping
  • Crystal/epitaxial growth
  • Wafer inspection
  • Load lock chambers
  • Scientific instruments: surface analysis, mass spectrometry, electron microscopy
  • High energy physics: beam lines, accelerators
  • Radioactive applications: fusion systems, cyclotrons
Technical data  
Inlet flange ISO200F
Outlet port KF40
Purge port KF16
Water cooling fitting PT1/4
Pumping Speed  
N2 1600 ls-1
H2 1200 ls-1
Compression ratio  
N2 >108
H2 >7 x 103
Ultimate pressure with bake out heating 10-7 Pa
Max allowable backing pressure 266 Pa (2 Torr)
Max Nitrogen throughput 2500 sccm
Rated speed 36500 rpm
Starting time 7 min
Mounting position Any
Water cooling flow 2 lmin-1
Temperature 5-25 °C
Pressure 0.3 MPa
Recommended purge gas flow 20 sccm
Input voltage 200 to 240 (± 10) V a.c.
Power consumption 0.85 kVA
Pump weight 35 kg
Controller weight 9 kg