STP301

STP301 is for use in electron microscopes and semiconductor applications. Edwards rotor technology gives class-leading performance for maximum process flexibility.

Features and Benefits

  • Advanced rotor technology  
    • Maximized process flexibility
    • Oil free
    • Low vibration
    • High reliability
    • Maintenance free
  • Advanced controller design  
    • Auto tuning
    • Self diagnostic functions
    • d.c. motor drive
    • Battery-free operation
  • Compact design  
    • Small footprint
    • Half rack controller

Applications

  • Plasma etch (chlorine, fluorine and bromine chemistries) for metal (aluminum), tungsten and dielectric (oxide) and polysilicon
  • Electron cyclotron resonance (ECR) etch
  • Film deposition CVD, PECVD, ECRCVD, MOCVD
  • Sputtering
  • Ion implantation source, beam line pumping end station
  • MBE
  • Diffusion
  • Photo resist stripping
  • Crystal/epitaxial growth
  • Wafer inspection
  • Load lock chambers
  • Scientific instruments: surface analysis, mass spectrometry, electron microscopy
  • High energy physics: beam lines, accelerators
  • Radioactive applications: fusion systems, cyclotrons
Technical data  
Inlet flange ISO100, CF100
Outlet port KF25
Pumping Speed  
  N2 300 ls-1
  H2 300 ls-1
Compression ratio  
  N2 >108
  H2 >2 x 104
Ultimate pressure with bake out heating (VG/ISO flange) 6.5 x 10-6 Pa (5 x 10-8 Torr)
Ultimate pressure with bake out heating (ICF flange) 10-8 Pa (10-10 Torr)
Maximum allowable inlet pressure (ambient cooled) 0.066 Pa (5 x 10-4 Torr)
Max continuous outlet pressure (ambient cooled) 13 Pa (0.1 Torr)
Rated speed 48000 rpm
Starting time 3 min
Maximum inlet flange temperature 120 °C
Input voltage 100 to 120 (± 10%) V a.c. or
  200 to 240 (± 10%) V a.c.
Power consumption at start up 0.55 kVA
Pump weight 11 kg
Controller weight 7 kg